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Gold-Bond 28 Electrically Conductive God Epoxy Adhesive Anti-Oxidation For High Reliability Devices

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Product Description

GOLD EPOXY ADHESIVE


PRODUCT DESCRIPTION:

Gold-Bond 28 Electrically Conductive God Epoxy Adhesive Anti-Oxidation For High Reliability Devices is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.

GENERAL PROPERTIES

Components A & B
Appearance Brown
Cure Type Room temperature or Heat cure
Benefits Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices.
It can be used in medical circuits using traditional hybrid packaging technologies.
High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight 100:13.5 / Resin:Hardener
Substrates Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics
Operating Temperature Continuous: - 55C to 275C
Intermittent: - 55C to 375C
Typical Applications Adhesive for joining die and SMDs onto the hybrid circuits
Repairing defective Au thick-film conductor traces and contact pads
Resisting oxidation and electro-migration in high-reliability micro-electronics
Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300C

UNCURED PROPERTIES:

Viscosity @ 25 C, mPas (cP) Paste
Pot Life 30 mins
Shelf Life 1 Year

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