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Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C

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Product Description

SILVER FILLED HEAT CURE HIGHLY FLEXIBLE ELECTRICALLY CONDUCTIVE EPOXY


PRODUCT DESCRIPTION:

Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature range (up to 190C) are required.

Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C is smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It can be used -- after REQUIRED high temperature cure cycle -- for the assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for high-frequency RF shielding, and for applications where a "hot" soldering iron is impractical.

When cured Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C is a hard, dimensionally stable, conductive material which is resistant to water, weathering, gases and vapors, lubricants, fuels, alcohol, and also to those salts, salt solutions, mild acids and alkalis, and other organic and inorganic compounds with which silver itself is compatible.

GENERAL PROPERTIES

Appearance Silver
Cure Type Heat cure or room temperature
Benefits High strength
Perfect bond
Mix Ratio by weight 100:5 / Resin:Hardener
Substrates Excellent choice for aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards
Typical Application assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for high-frequency RF shielding, and for applications where a "hot" soldering iron is impractical.

UNCURED PROPERTIES

Mixed Viscosity 25,000
Specific Gravity, mixed 2.66
Reactive solids contents, % 100
Pot Life 3 hours
Shelf life 1 year

CURE SCHEDULE

2 hours @ 100C
1 hour @ 125C
24 hour @ Room Temperature

CURED PROPERTIES

Hardness, Shore D 85
Adhesive bond strength 1270 psi
Volume Resistivity ohm-cm < 0.0003

THERMAL PROPERTIES

CTE, linear 27.2 in/in-F @ Temperature 68.0 F
Thermal Conductivity 1.50 W/m-K
10.4 BTU-in/hr-ft-F
Glass Transition Temp, Tg 92.0 C 198 F
Operating Temperature -60 to 190 C

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply Silver-Bond 24 High Heat Resistance Silver Conductive Epoxy Adhesive Up To 190C completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.

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