PRODUCT DESCRIPTION:
Silver-Bond G2 Low Cost, Silver Coated Glass Sphere, Electrically Conductive, Epoxy Adhesive is a single component epoxy, formulated with silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of Conventional silver conductive.
Silver-Bond G2 Low Cost, Silver Coated Glass Sphere, Electrically Conductive, Epoxy Adhesive Formulated with Silver coated ceramic power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.
Silver-Bond G2 Low Cost, Silver Coated Glass Sphere, Electrically Conductive, Epoxy Adhesive formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.
Silver-Bond G2 Low Cost, Silver Coated Glass Sphere, Electrically Conductive, Epoxy Adhesive designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry.
PHYSICAL PROPERTIES:
| Appearance | Silver Coated ceramic |
| Cure Type | Heat cure |
| Viscosity | 6,800 |
| Benefits | High strength
Perfect bond
EMI & RFI shielding
Wave guides |
| Substrates | Excellent choice for the Integrated Circuits, aluminum, copper, magnesium,steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. |
| Catalyst | Anhydride |
| Typical Application | diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, static shielding, connections, and circuitry. |
CURED PROPERTIES:
| Sheet Resistivity | <0.1 /sqcm |
| Lap shear strength | 2000 Lb/in2 (1400 N/cm2) |
| Adhesion Tensile Strength | 1000 N/cm2 (1500 lb/in2) |
| Thermal Conductivity | 0.04J/(cm.s. C) [0.01cal/(cm.s. C)] |
| Specific heat | 0.30J/(g. C) :[0.07 cal/g. C] |
| Coefficient of Thermal Expansion | 3x10-5 (m/m)/ C |
| Modulus of elasticity | 4x1010 Pa (6x105 lb/in2) |
CURE SCHEDULE:
| 0.7 hours | @ 200C, 392F |
| 1.5 hours | @ 180C, 356F |
| 2.5 hours | @ 160C, 320F |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply Silver-Bond G2 Low Cost, Silver Coated Glass Sphere, Electrically Conductive, Epoxy Adhesive completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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