How do I use this pouch?

Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive

$19.99

Shipping:

Calculated at checkout

* Size:

2.5gm plunger syringe(s)
5gm plunger syringe(s)
10gm plunger syringe(s)
50gm jar(s)
100gm jar(s)
250gm jar(s)
500gm jar(s)

Quantity:

TDS
Product Review
Find Similar Products by Category

Product Description

HEAT CURE, SILVER FILLED ELECTRICALLY CONDUCTIVE EPOXY MAXIMUM CONTINUITY OF CONDUCTIVITY

PRODUCT DESCRIPTION:

Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly.

Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive offers excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication.

Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.

Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping techniques. It is available in both a lower and higher viscosity grade for use in a variety of dispensing equipment and application techniques.

CURED PROPERTIES:

Hardness, Shore D	83

PRODUCT PROPERTIES:

Appearance	Silver
Cure Type	Heat cure
Benefits	High strength Excellent mechanical, electrical properties
Substrates	Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic and G-10 epoxy glass boards.
Typical application	microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.

CURE SCHEDULE:

2 hours	@ 125C
1 hour	@ 150C
1/2 hours	@ 175C

UNCURED PROPERTIES:

Viscosity @ 25 C cps	200,000
Shelf life	6 Months
Density	3.6

THERMAL PROPERTIES:

Thermal Conductivity, btu/hr/ft2/F/in	16.1
Coefficient of Thermal Expansion	60x 10^-6 (in/in) C
Operating Temperature	-55C to +175C Intermit. to 325

ELECTRICAL PROPERTIES:

Volume Resistivity ohm. cm	< 0.001

NASA OUTGASSING RESULTS:

TML (Total Mass Loss)	% 0.38
CVCM (Collected Volatile Condensable Materials) %	0.01
WVR (Water Vapor Recovery) %	0.07

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.