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Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing

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Product Description

LOW VAPOR PRESSURE EPOXY STAKING COMPOUND

PRODUCT DESCRIPTION:

Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies.

Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing is two-part, solvent-free compound is readily mixed, handled, used, and cured at room temperature, and develops strong bonds to most clean, dry material surfaces including metals, glass, ceramics, wood and many plastics.

Strong-Bond 116 Low Vapor Pressure, Epoxy Staking Compound, 2 Part, Passes NASAs Outgassing bonds provide electrical insulation and excellent resistance to weather, galvanic action, petroleum solvents and lubricants, gasoline, jet fuels, alcohol, salts, and mild acids and alkalis.

GENERAL PROPERTIES

Appearance	Milky translucent
Cure Type	Room temperature or Heat Cure
Benefits	Passes NASA's Outgassing/Low Outgassing Solvent free Weather resistant
Mix Ratio by weight	100:22.5 / Resin:Hardener
Substrates	Ceramics, glass to glass, fabrics, metals, laminates and other composite materials
Operating Temperature	-60 to 130 C
Typical Application	critical electronics, aerospace, and industrial applications where a high-fill, non-sag reliable adhesive is required for bonding and enhancing the mechanical and structural rigidity of assemblies

UNCURED PROPERTIES:

Specific Gravity	1.25
Reactive solids contents, %	100
Pot Life	30 minutes
Viscosity	100,000

CURE SCHEDULE:

4 hours	@ 65C
24 hours	@ 25C

MISC PROPERTIES:

Volume Resistivity	6.00e+13 ohm-cm
Dielectric Constant	4.5
Dielectric Strength	410 kV/mil
Hardness, Shore D	88

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply this completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.