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Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive

$5.99

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Product Description

HEAT CONDUCTIVE ELECTRICALLY INSULATING COMPOUND

PRODUCT DESCRIPTION:

Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards.

Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.

PRODUCT PROPERTIES

Appearance	Tan
Cure Type	Heat cure or Room Temperature
Benefits	Fast cure Strong Durable High-impact bonds at room temperature
Mix Ratio by weight	100:23 / Resin:Hardener
Substrates	Bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials
Typical Applications	Fiber optic bundles, potting glas fibers and fiber optic connectors

UNCURED PROPERTIES

Viscosity @ 25 C	12,000 1000 (After Mixing) @ Temperature 77.0 F, 25C
Specific Gravity, mixed	2.294
Reactive solids contents, %	100
Pot Life	5 minutes
Shelf life	1 Year

THERMAL PROPERTIES

Glass transition temperature (Tg),	-40C, 100F
Lap shear strength, psi	3400 (Alum to Alum)
Operating Temperature	-40 to 100 C
Cure Time	5 minutes
CTE, linear	14.4 in/in-F @Temperature 68.0 F
Thermal Conductivity	0.840 W/m-K 5.83 BTU-in/hr-ft-F

CURE SCHEDULE

1 Hour	@ 125C
3 Hours	@ 65C
24 Hours	@ 25C

MECHANICAL PROPERTIES

Hardness, Shore D	79
Adhesive Bond Strength	3400 psi

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply the Strong-Bond 56 Staking Compound Low Thermal Expansion Encapsulation Epoxy Adhesive completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.