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Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing

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Product Description

THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND


PRODUCT DESCRIPTION:

Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.

Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.

Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.

Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.

GENERAL PROPERTIES

Appearance Dark Grey
Cure Type Heat cure or Room Temperature
Benefits Strong
Durable
High impact bonds at room temperature
Mix Ratio by weight 100:7 / Resin: Hardener
Outgassing, NASA Passes
Typical Applications Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards

UNCURED PROPERTIES

Specific Gravity, mixed 2.44
Reactive solids contents, % 100
Pot Life 30 minutes
Shelf life 1 Year

THERMAL PROPERTIES

CTE, linear 10.0 µin/in-°F @ Temperature 68.0 °F
Thermal Conductivity 6.94 BTU-in/hr-ft-F
1.00 W/m-K
Glass transition temperature (Tg), C 110 C, 230 F
Operating Temperature -70 to 110 C / -94 to 230 F

CURED PROPERTIES

Hardness, Shore D 90
Dielectric strength, volts/mil 410

CURE SCHEDULE

2 4 Hours @ 65C
24 Hours @ 25C

ELECTRICAL PROPERTIES

Volume Resistivity 5.50e+15 ohm-cm
4.00e+13 ohm-cm @ Temperature 212 F
Dielectric Constant 6.0 @ Frequency 1000 Hz
Dielectric Strength 410 kV/in
Dissipation Factor 0.010 @ Frequency 1000 Hz

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply Strong-Bond 53 Thermally Conductive, Electrically Insulating Compound, 2 Part, Thixtropic Low NASA Outgassing completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best result.

AVAILABILITY:

This epoxy can be supplied in various different packages.

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