How do I use this pouch?

Strong-Bond 91 Structure Bonding, No Sag, Room Temp Cure, Epoxy Adhesive, Overhead Surfaces

$4.99

Shipping:

Calculated at checkout

* Size:

2.5gm pouch(s)
5gm pouch(s)
10gm pouch(s)
100gm kit(s)

Quantity:

TDS
Product Review
Find Similar Products by Category

Product Description

THIXOTROPIC ROOM TEMPERATURE CURE EPOXY ADHESIVE

PRODUCT DESCRIPTION:

Strong-Bond 91 Structure Bonding, No Sag, Room Temp Cure, Epoxy Adhesive, Overhead Surfaces is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical.

Strong-Bond 91 Structure Bonding, No Sag, Room Temp Cure, Epoxy Adhesive, Overhead Surfaces is medium exotherming system exhibits excellent flow and wetting characteristics.

GENERAL PROPERTIES

Cure Type	Heat cure or Room temperature
Benefits	Excellent flow Excellent wetting characteristics Works on a wide variety of substrates
Mix Ratio by weight	100:81 / Resin:Hardener
Substrates	Glass, most metals, and variety of plastics
Typical Applications	Structural bonding, overhead and vertical applications
Pot Life	45 minutes

CURE SCHEDULE:

1 hour	@ 65C
24 hours	@ 25C

MISC PROPERTIES:

Volume Resistivity	2.70e+13 ohm-cm
Hardness, Shore D	78
Lap shear	3300 psi (Alum to Alum)

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply Strong-Bond 91 Structure Bonding, No Sag, Room Temp Cure, Epoxy Adhesive, Overhead Surfaces mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.