behars Loading... Please wait...
 
freegift
Image 1

FDA-Bond 2 Food & Drug Administration Medical Grade Epoxy Adhesive, Low Viscosity RT Cure

1 product review
$4.99
Shipping:
Calculated at checkout
Maximum Purchase:
300 unit(s)
Quantity:

Product Description

FOOD AND DRUG APPLICATION EPOXY ADHESIVE

PRODUCT DESCRIPTION:

FDA-Bond 2 Food & Drug Administration Medical Grade Epoxy Adhesive, Low Viscosity RT Cure is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received Class VI approval.

FDA-Bond 2 Food & Drug Administration Medical Grade Epoxy Adhesive, Low Viscosity RT Cure is two part amber adhesive used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment and devices.

FDA-Bond 2 Food & Drug Administration Medical Grade Epoxy Adhesive, Low Viscosity RT Cure provides low permeability to gases and vapors, and good resistance to water, weather, petroleum solvents, lubricants, to mild acids and alkalis, and to many other organic and inorganic compounds.

GENERAL PROPERTIES

Appearance Amber
Cure Type Heat cure or Room Temperature
Benefits Medium viscosity
Class VI approved
Easily mixed
Low permeability
Good resistance
Mix Ratio by weight 100:100 / Resin:Hardener
Substrates Most metals, ceramic, glass and plastics
Operating Temperature -70 to 145 C
Typical Applications Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
Minimum Service Temperature, Air -94 F

UNCURED PROPERTIES:

Viscosity @ 25 C 14,000 2000
Specific Gravity, mixed 1.11
Reactive solids contents, % 100
Pot Life 45 minutes

CURE SCHEDULE:

1-4 hours @ 65C
24 hours @ 25C

CURED PROPERTIES:

Glass transition temperature (Tg), C 54
Hardness, Shore D 79
Dielectric strength volts/mil 420
Water Absorption, % .004
Lap shear strength, psi 2700 (Aluminum to Aluminum)
Volume Resistivity 1.20e+14 ohm-cm
Dielectric Constant 3.4 @ Frequency 1000 Hz
Dissipation Factor 0.020 @ Frequency 1000 Hz

GENERAL INFORMATION:

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

HOW TO USE:

1) Carefully clean and dry all surfaces to be bonded.

2) Apply FDA-Bond 2 Food & Drug Administration Medical Grade Epoxy Adhesive, Low Viscosity RT Cure completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.

3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.

4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.

AVAILABILITY:

This epoxy can be supplied in various different packages.

Product Reviews

Write Review

  1. Great product

    Posted by Unknown on Feb 18th 2018

    While repairing an old Melmac plastic bowl from the 1960's wouldn't be worth the effort to some, this product enabled pinpoint accuracy and ease in application. When used as suggested it cured to bind the three sections of the bowl together for a permanent and barely visible repair.

TDS | SDS

Back to Top