PRODUCT DESCRIPTION:
FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administration (FDA) Chapter 1, Sub Part B, Sections 175.105 and 175.300.
FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors is two-parts tan adhesive is easily mixed, used and cured at room temperature for bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices.
FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors is an effective electrical insulator, and it provides low permeability to gases and vapors, and good resistance to water, weather, galvanic action, to petroleum solvents, lubricants and fuels, to mild acids and alkalis, and to many other organic and inorganic compounds
PRODUCT PROPERTIES:
| Appearance |
Light Tan |
| Cure Type |
Heat cure or Room temperature |
| Benefits |
High viscosity
Easily mixed
Electrical insulator
Low permeability
Good resistance |
| Mix Ratio by weight |
100:40 / Resin:Hardener |
| Substrates |
Most metals, ceramic, glass and plastics |
| Operating Temperatures |
-70 to 145 C |
| Typical Applications |
Bonding, laminating and repair applications by manufacturers of food preparation, processing and packaging equipment, and by manufacturers of catheters, hearing aids, dental products and other biomedical instruments and devices. |
UNCURED PROPERTIES:
| Viscosity @ 25 C, cps |
27,000 |
| Thixotropic Index |
1.2 |
| Specific Gravity, mixed |
1.44 |
CURED PROPERTIES:
| Hardness, Shore D |
78 |
| CTE, Linear |
26.1 in/in-F |
| Dielectric strength kv/in |
420 |
| Volume Resistivity ohm-cm |
1.50e+14 ohm-cm |
| Elongation at Yield |
5.0 % |
| Adhesive Bond Strength |
2100 psi Lap shear, alum to alum |
ELECTRICAL PROPERTIES:
| Dielectric Constant |
3.5 @ frequency 1000 Hz |
| Dielectric Strength |
420 kV/in |
| Dissipation Factor |
0.020 @ frequency 1000 Hz |
CURE SCHEDULE:
| 1-4 Hours |
@ 65C |
| 24 to 36 Hours |
@ 25C |
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1) Carefully clean and dry all surfaces to be bonded.
2) Apply FDA-Bond 22 Medical Grade Epoxy Adhesive, Low Permeability to Gases and Vapors completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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