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Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC

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Product Description

THERMALLY CONDUCTIVE HEAT SINK COMPOUND


PRODUCT DESCRIPTION:

Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC is an opaque white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device.

Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC is silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation.

Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC thermal compound resists changes in consistency temperatures up to 180C; function as heat transfer media, durable dielectric insulation, barrier against environmental contaminants and as a stress-relieving shock and vibration absorber over a wide temperature and humidity range.

Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC thermal paste is resistant to ozone and ultraviolet degradation and has good chemical and solvent stability, good interference between the heat producing device and the heat transfer media, and low surface tension that enables them to wet most surfaces. Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC will not harden, dry, or melt after 1200 hours @ 205C.

ELECTRICAL PROPERTIES

Dielectric Strength, volts/mil (ASTM D 150) 390
Dielectric Constant @ 100Hz (ASTM D150) 4.40
Dissipation Factor @ 100Hz (ASTM D150) 0.0021
Volume Resistivity, ohm-cm (ASTM D257) 2.9x1014

THERMAL PROPERTIES:

Thermal Conductivity W/m-K 0.88
Operating Temperature Range, C -60 to 205
Thermal Resistance C-In2 /W 0.05

LIMITATIONS:

Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC is neither tested nor represented as suitable for medical or pharmaceutical use.

CLEAN UP & DISPOSAL:

Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC can be removed by using solvents such as mineral spirit, heptane, or isopropyl alcohol. Dispose of in accordance with local, state and federal regulations for hazardous waste.

TYPICAL PROPERTIES AND CHEMICAL CHARACTERISTICS:

Color White
Base Fluid Dimethyl Polysiloxane
Filler Zinc oxide
Specific Gravity, 25C, gm/cc 2.45
Viscosity Paste
Press Flow @ 42.5 PSI, 25C sec 13
Penetration (Worked), mm 2851/10
Evaporation 24 hrs @25C, % 0.0
Evaporation @ 200C 24H by weight,% 0.5
Bleed 24 Hours, % 0.6

STORAGE HANDLING & SHELF LIFE:

Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC has a shelf life of 5 years at room temperature (76F) in an unopened container, settlings may occur during long term storage, it is recommended to re-mix the filler by hand or mechanical mixing. Keep container tightly closed store in cool area away from ignition sources and oxidizers, no special precautions need to be taken if product is handled according to directions. Shelf Thermal-Grease 4 Heat Sink, Thermally Conductive Compound, MIL-DTL-4-7113, Low Bleed, Low VOC is neither tested nor represented as suitable for medical or pharmaceutical use.

POTENTIAL USES:

  • Effective thermal coupler for any heat sink device, CPU to heat sink.
  • Automotive temperature-sensing devices.
  • Temperature sensors.
  • Applied to the base and mounting studs of transistor, diodes and silicone controlled rectifiers.
  • Power transistors.
  • Diodes, semiconductors.
  • Thermal Joints.
  • For any device where efficient cooling is required.
  • Potting.
  • TEC Modules.
  • Hardware.
  • Telecommunications.
  • Right product for thermal management.
  • High-voltage corona suppressant in connectors for fly back transferors located in TV sets.

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